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MY'STORY

The MOVE Fire

This is a personal recollection on the Move fire on May 13, 1985 Philadelphia police fired thousands of rounds at the MOVE house, city officials approved dropping an explosive device on the roof, the resulting fire was allowed to burn, 11 people—including five children—died, and 61 homes were destroyed. Philadelphia City Council later called it a “brutal attack carried out by the City of Philadelphia on its own citizens” and acknowledged that no individual faced criminal consequences for the bombing. One timeline correction worth preserving for the BHP record: the major previous MOVE-police confrontation was August 8, 1978, about seven years before the bombing, not a year or two earlier. Officer James Ramp was killed, other police and firefighters were wounded, nine MOVE members were later convicted, and television cameras recorded police beating Delbert Africa during his arrest. The 1985 MOVE Commission later specifically criticized city planners for failing to adequately use lessons from that 1978 confrontation. And that actually strengthens the point you’re making: 1985 did not happen without precedent or institutional memory. There had already been a deadly confrontation with MOVE, years of conflict, negotiations and police involvement before Osage Avenue.

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BLACK FACTS
The Truths They Never Taught You...

Ruler of the Mali Empire in the 14th century

Mansa Musa was the ruler of the Mali Empire in West Africa. Details recorded here should be sourced; unknown information is left blank.

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BHP gathered finds from its connected research sources. Showing the 4 strongest Black History matches.
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Wikipedia

IPC (electronics)

IPC (Now Global Electronics Association)
Formation1957; 69 years ago (1957)
TypeIndustry association
HeadquartersBannockburn, Illinois United States
Chairman
Robert Neves
President and CEO
John W. Mitchell
Websitewww.electronics.org
Formerly called
Institute of Printed Circuits, Institute for Interconnecting and Packaging Electronic Circuits

IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.[1]

IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization[2] and is known globally for its standards. It publishes the most widely used acceptability standards in the electronics industry.

History

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It was founded in 1957 as the Institute of Printed Circuits. Its name was later changed to the Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999, the organization formally changed its name to IPC with the accompanying tagline, Association Connecting Electronics Industries.[3]

Standards

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IPC standards are used by the electronics manufacturing industry. IPC-A-610,[4] Acceptability of Electronic Assemblies, is used worldwide by original equipment manufacturers and EMS companies. There are more than 3600 trainers worldwide who are certified to train and test on the standard. Standards are created by committees of industry volunteers. Task groups have been formed in China, the United States, and Denmark.

IPC Standard Tree

Standards published by IPC include:

General documents
  • IPC-T-50 Terms and Definitions
  • IPC-2615 Printed Board Dimensions and Tolerances
  • IPC-D-325 Documentation Requirements for Printed Boards
  • IPC-A-31 Flexible Raw Material Test Pattern
  • IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
Design specifications
  • IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
  • IPC-2141A Design Guide for High-Speed Controlled Impedance Circuit Boards
  • IPC-2221 Generic Standard on Printed Board Design
  • IPC-2223 Sectional Design Standard for Flexible Printed Boards
  • IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuit
  • IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standards
Material specifications
  • IPC-FC-234 Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits
  • IPC-4562 Metal Foil for Printed Wiring Applications
  • IPC-4101 Laminate Prepreg Materials Standard for Printed Boards
  • IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry
  • IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
  • IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Performance and inspection documents
  • IPC-A-600 Acceptability of Printed Boards
  • IPC-A-610 Acceptability of Electronic Assemblies
  • IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
  • IPC-6011 Generic Performance Specification for Printed Boards
  • IPC-6012 Qualification and Performance Specification for Rigid Printed Boards
  • IPC-6013 Specification for Printed Wiring, Flexible and Rigid-Flex
  • IPC-6018 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
  • IPC- 6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
  • PAS-62123 Performance Guide Manual for Single & Double Sided Flexible Printed Wiring Boards
  • IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards
Flex assembly and materials standards
  • IPC-FA-251 Assembly Guidelines for Single and Double Sided Flexible Printed Circuits
  • IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives
  • IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films

Market research

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IPC members are eligible to participate in IPC’s statistical programs, which provide free monthly or quarterly reports for specific industry and product markets. Statistical programs cover the electronics manufacturing services (EMS), printed circuit board (PCB), laminate, process consumables, solder and assembly equipment segments.[5]

Annual reports are distributed for the EMS and PCB segments, covering market size and sales growth, with breakdowns by product type and product mix as well as revenue trends from value-added services, trends in materials, financial metrics, and forecasts for total production in the Americas and the world.

Monthly market reports for the EMS and PCB segments provide recent data on market size, sales and order growth, book-to-bill ratios and near-term forecasts.[5]

Classes

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The IPC have established three classes of workmanship standards for assemblies, IPC Class 1, IPC Class 2, and IPC Class 3.[6]

Usually both Class 1 and Class 2 focus on consumer clients and Class 3 is for industrial use.

Notes

[edit]
  1. ^ "About IPC". IPC. 19 June 2020. Retrieved 2021-11-10.
  2. ^ "Standards Developing Organizations (SDOs)". ANSI. Archived from the original on 18 March 2021. Retrieved 5 January 2011.
  3. ^ "History of IPC's Name". IPC. Retrieved 5 January 2011.
  4. ^ Radcliff, katy (2018-09-26). "IPC-A-610 Specialist Training Using EDGE 2.0". katy Radcliff. Retrieved 2018-10-13.
  5. ^ a b "Market Research from IPC". IPC. Archived from the original on 2014-09-28. Retrieved 2014-10-16.
  6. ^ "Understanding IPC Class 1, 2, & 3 Certifications". EI Micro.
[edit]

Source: Wikipedia. Article content is retrieved live through the MediaWiki API.

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Wikipedia

IPC (electronics)

IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium. IPC is accredited by the American National Standards Institute (ANSI) as a standards developing organization and is known globally for its standards. It publishes the most widely used acceptability standards in the electronics industry.

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Wikipedia

SMEMA

SMEMA is an acronym for the Surface Mount Equipment Manufacturers Association. In 1999 they merged with the IPC to form the IPC SMEMA Council. One standard they have is for the wiring of communications between Surface mount technology producing machinery such as a Stencil Printer or a Pick and Place Machine on an Electronics production line. This allows the machines, including the "bridges" between the two known simply as conveyors, to communicate that they are busy, or awaiting a circuit board. The communication only goes sequentially, as there is no addressing. Instead the machine's SMEMA cables connect to each other's upstream or downstream plug. The plugs and wires are multimate connectors and receptacles consisting of 14 wire connections. However, only 4 wires are used for data, while the 8th pin connection is the shielding.

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Wikipedia

Printed electronics

Printed electronics is a set of printing methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography, and inkjet. By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as thin-film transistors, capacitors, coils, and resistors. Some researchers expect printed electronics to facilitate widespread, very low-cost, low-performance electronics for applications such as flexible displays, smart labels, decorative and animated posters, and active clothing that do not require high performance. The term printed electronics is often related to organic electronics or plastic electronics, in which one or more inks are composed of carbon-based compounds. These other terms refer to the ink material, which can be deposited by solution-based, vacuum-based, or other processes. Printed electronics, in contrast, specifies the process, and, subject to the specific requirements of the printing process selected, can utilize any solution-based material. This includes organic semiconductors, inorganic semiconductors, metallic conductors, nanoparticles, and nanotubes. The solution usually consist of filler materials dispersed in a suitable solvent. The most commonly used solvents include ethanol, xylene, Dimethylformamide (DMF), Dimethyl sulfoxide (DMSO), toluene and water, whereas, the most common conductive fillers include silver nanoparticles, silver flakes, carbon black, graphene, carbon nanotubes, conductive polymers (such as polyaniline and polypyrrole), and metal powders (such as copper or nickel). Considering the environmental impacts of the organic solvents, researchers are now focused on developing printable inks using water. For the preparation of printed electronics nearly all industrial printing methods are employed. Similar to conventional printing, printed electronics applies ink layers one atop another. So the coherent development of printing methods and ink materials are the field's essential tasks. The most important benefit of printing is low-cost volume fabrication. The lower cost enables use in more applications. An example is RFID-systems, which enable contactless identification in trade and transport. In some domains, such as light-emitting diodes printing does not impact performance. Printing on flexible substrates allows electronics to be placed on curved surfaces, for example: printing solar cells on vehicle roofs. More typically, conventional semiconductors justify their much higher costs by providing much higher performance.

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Wikipedia

Flexible electronics

Flexible electronics, also known as flex circuits, encompass various technologies that are used for assembling electronic circuits by mounting electronic components on flexible plastic substrates, such as polyimide, PEEK, or transparent conductive polyester film. Additionally, flex circuits can have the form of screen-printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape or to flex during its use.

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TOPIC OF THE DAY

Greenwood / Black Wall Street

Before the 1921 destruction of Tulsa’s Greenwood District, Black residents had created a remarkable center of business and community life. The district included stores, professional offices, entertainment venues and homes owned by Black citizens. Understanding Greenwood means learning what was built—not only what was burned.

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TRIVIA QUESTION OF THE DAY

Who became the first Black woman to travel into space?

Mae Jemison, aboard Space Shuttle Endeavour in 1992.